Active WIPECOS55-2604
Spring shared run
Tapeout completed. Wafer fabrication is in progress with Ark MPW01, Freighter MPC01, and Cruise MPC01.
- Submit deadline2026-03-18
- User designs28 onboarded
- Current WIPMask Layer 17 / 28
Shuttle Gallery
Find the next ECOS55 departure.
Shuttles group template instances, user designs, signoff deadlines, manufacturing WIP, and delivery dates into one trackable voyage.
Airport Board
Boarding, fabrication, and future runs in one operational view.
Mock shuttle data is shaped like a manufacturing departure board: what is open for orders, what is already in WIP, and what has delivered.
FlightTemplateDeadlineStatus
ECOS55-2604Ark / MPC2026-03-18Wafer Fab
ECOS55-2607Freighter2026-06-30Boarding
ECOS55-2610All templates2026-09-15Open
ECOS55-2701Ark / Cruise2026-12-15Planned
Live Gallery
Active, open, planned, and historical shuttles.
Each card shows the user-facing status, representative chips, and realistic submission counts for design review.
OpenECOS55-2610
Fall all-template shuttle
Open for Ark, Freighter, Cruise, and OSOC orders. Deadline notice matches the landing page hero.
- Submit deadline2026-09-15
- Capacity used41%
- Entry price$50 / ¥330
PlannedECOS55-2701
New year education run
Planned for Ark and Cruise first, with OSOC capacity reserved for verified course milestones.
- Projected deadline2026-12-15
- Planned chips4 template chips
- StatusCapacity planning
DeliveredECOS55-2511
Pilot bring-up batch
Historical pilot used to demonstrate submission, signoff, packaging, board assembly, and customer shipping.
- Tape-in2025-11-20
- Delivered2026-05-22
- User designs12 validated
OpenECOS55-2607
Freighter fast lane
Focused MPC shuttle for small ASIC modules that need 73 programmable IOs and a development board path.
- Submit deadline2026-06-30
- Slots available9 of 24
- Signoff modeManual review
ClosedECOS55-2601
Closed Ark prototype run
Historical MPW-heavy shuttle with private die submissions for full SoC and mixed-signal prototype work.
- Submit deadline2026-01-12
- Current WIPPackaging
- Orders6 MPW dies
ECOS55-2604 Tapeout Voyage
Mock WIP timeline using the platform brief's manufacturing milestones.
Design SubmittedAll bound submissions locked after deadline.
Actual 2026-03-18GDS ReadyTemplate integration and final signoff package complete.
Actual 2026-04-04TapeOutFoundry package released.
Actual 2026-04-09JDV checkManufacturing data verification accepted.
Actual 2026-04-17Wafer StartLot started in ECOS55 production flow.
Actual 2026-04-29Mask INMask set released to fabrication.
Actual 2026-05-07Wafer FabricationMask Layer Progress: 17 of 28 completed.
Actual 2026-06-09Wafer OutElectrical sort and outgoing checks.
Planned 2026-07-22PackagingBare die, default package, and selected custom package lanes.
Planned 2026-08-18Customer ShippingShipment after board assembly for orders that selected devboards.
Planned 2026-09-20Chips and user designs
Representative chip instances and anonymized user submissions.
| Chip ID | Template | User designs | Signoff | WIP |
|---|---|---|---|---|
| ECOS55-2604-Ark-MPW01 private die |
Ark MPW | edge-ai-mcu by Maya Chen | Passed | 62% complete |
| ECOS55-2604-Freighter-MPC01 shared chip |
Freighter MPC | sensor-fusion-asic, tiny-pll-test, gpio-lab-core | Passed | 62% complete |
| ECOS55-2604-Cruise-MPC01 shared RISC-V chip |
Cruise MPC | tiny-riscv-core, rv-audio-dsp, timer-lab-soc | Passed | 62% complete |
| ECOS55-2610-OSOC-MPC01 boarding |
OSOC MPC | ysyx-cpu-echo, ysyx-cache-lab, ysyx-uart-demo | Pending | 12% complete |