Builder Console

Designs, orders, signoff, and Tapeout Voyage.

A mock logged-in dashboard for managing design submissions, binding orders, paying after signoff, and tracking manufacturing WIP.

My Designs4

My Orders3

Coupons2

tiny-riscv-core
Cruise MPC

PassedPaid

sensor-fusion-asic
Freighter MPC

PendingOrder draft

edge-ai-mcu
Ark MPW

UnsubmittedNo order

My Designs

Submitted design assets and signoff status by template.

Design	Template	Required files	Signoff	Order
tiny-riscv-core SUB-2607-018	Cruise MPC 36 IO + retroSoC	DEF, Verilog netlist	Passed DRC/LVS/density/XOR accepted	ORD-2607-104
sensor-fusion-asic SUB-2610-042	Freighter MPC 73 programmable IOs	DEF, Verilog netlist	Pending Manual signoff review queued	Draft order
edge-ai-mcu SUB-2610-059	Ark MPW private 2.4 mm² die	GDS required, DEF optional	Unsubmitted Ready to bind to order	Not bound
ysyx-cache-lab SUB-2610-064	OSOC MPC course-aligned	DEF, Verilog netlist	Failed Clock constraint report needs update	Not payable

Orders bind a submission to a shuttle and selected services.

Order	Bound submission	Services	Payment	Tapeout Voyage
ORD-2607-104 ECOS55-2607	tiny-riscv-core Cruise MPC	Default package, devboard, bring-up	Paid $730 mock total	GDS Ready
ORD-2610-033 ECOS55-2610	sensor-fusion-asic Freighter MPC	Signoff, default package	Awaiting signoff Payment locked	Design Submitted
ORD-2604-087 ECOS55-2604	gpio-lab-core Freighter MPC	Bare die, board assembly	Paid $580 mock total	Wafer Fabrication

Detailed manufacturing status for ORD-2604-087.

In progress

Design SubmittedSubmission bound to order before deadline.

Actual 2026-03-18

GDS ReadyTemplate integration and final package prepared.

Actual 2026-04-04

TapeOutFoundry handoff complete.

Actual 2026-04-09

JDV checkManufacturing data verification accepted.

Actual 2026-04-17

Wafer StartLot entered fabrication.

Actual 2026-04-29

Mask INMask set released.

Actual 2026-05-07

Wafer FabricationMask Layer Progress: diffusion, poly, and metal layers are being tracked.

Actual 2026-06-09

Wafer OutSort and release from foundry.

Planned 2026-07-22

Wafer DicingDice prepared for package and bare die delivery.

Planned 2026-08-02

PackagingDefault package lane for selected orders.

Planned 2026-08-18

Board AssemblyDevboard assembly and bring-up support.

Planned 2026-09-03

Customer ShippingShipment and delivery confirmation.

Planned 2026-09-20