Multi Project Wafer
Ark allocates a dedicated die for one user design. It is the best fit when you need full chip freedom, custom dimensions, or a complete SoC/ASIC prototype.
- User boundaryDedicated die
- Required packageGDS
- Minimum area1 mm²
Templates define sharing mode, area range, required upload files, IO expectations, service compatibility, and the signoff checklist that turns a local design into a manufacturable submission.
Both modes use the same platform objects: Template, Shuttle, Submission, Order, Signoff, and Tapeout Voyage.
Ark allocates a dedicated die for one user design. It is the best fit when you need full chip freedom, custom dimensions, or a complete SoC/ASIC prototype.
Freighter, Cruise, and OSOC share pad rings, test structures, boards, and package options so tiny designs can enter a shuttle at much lower cost.
The visuals are generated locally on canvas for this prototype; they are schematic, not foundry layout data.
Area ranges, IO counts, and service fit are realistic mock assumptions and should be checked by engineering owners before public launch.
template/ark
Dedicated die for commercial ASIC prototypes, complete SoCs, MCUs, accelerators, high-speed interface chips, and custom mixed-signal work.
template/freighter
Shared chip route with programmable IO for small ASIC, mixed-signal module, and fast prototype builders who want low entry cost.
template/cruise
RISC-V oriented route with retroSoC infrastructure, board support, SDK references, and bring-up guidance for small CPU designs.
template/osoc
Education-aligned route for One Student One Chip style projects using a standard SoC environment, SDK, board flow, and incentive review.
shared signoff surface
requiredrequiredrequiredreviewedby service