Shuttle Operations
ECOS55 tapeout runs with clear dates, gates, and voyage status.
Shuttles are manufacturing batches. Each run contains chips instantiated from templates, then moves through signoff, tapeout, fabrication, packaging, board assembly, and shipping.
Departure Board
Open and planned shuttles.
Dates, capacities, and prices are realistic mock data for prototype review.
FlightGateDeadlineStatus
ECOS55-2610Ark / Freighter / Cruise / OSOC2026-09-15Boarding
ECOS55-2612Freighter / OSOC2026-11-30Check-in
ECOS55-2703Ark / Freighter / Cruise / OSOC2027-02-20Scheduled
ECOS55-2706Ark / Freighter2027-05-18Planning
Active WIP
ECOS55-2610 Tapeout Voyage.
Users can see whether the order is waiting on signoff, payment, fabrication, package, board, or logistics.
ECOS55-2610-Freighter-MPC01
TapeOut in progress
- Design SubmittedActual date: 2026-08-29
- GDS ReadyActual date: 2026-09-08
- TapeOutActual date: 2026-09-16
- JDV checkPlanned date: 2026-09-24
- Wafer StartPlanned date: 2026-10-02
- Mask INPlanned date: 2026-10-10
- Wafer FabricationPlanned date: 2026-10-18, mask layers M1-M8 mocked.
- Wafer OutPlanned date: 2027-01-22
- Wafer DicingPlanned date: 2027-02-04
- PackagingPlanned date: 2027-02-18
- Board AssemblyPlanned date: 2027-03-05
- Customer ShippingPlanned date: 2027-03-18
Historical Gallery
Mock chips and user designs from prior shuttles.
The gallery gives the product a concrete manufacturing memory while staying independent from protected external assets.