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ECOS55-2610 tapeout deadline: 2026-09-15

Scheduled voyages for real silicon.

Mock shuttle data shows open, planned, historical, and in-progress ECOS55 tapeout batches with realistic dates, chip IDs, and WIP states.

Open And Planned Shuttles

Boarding now, opening soon, and already mapped.

ShuttleTemplatesSubmit DeadlineStatus
ECOS55-2610Ark, Freighter, Cruise, OSOC2026-09-15Open
ECOS55-2612Freighter, Cruise, OSOC2026-11-30Open Soon
ECOS55-2703Ark, Freighter2027-02-20Planned
ECOS55-2706Cruise, OSOC2027-05-18Planned

Active WIP

ECOS55-2606 is already on the voyage.

Orders tied to the June 2026 shuttle are shown in manufacturing WIP with a typical tape-in to delivery estimate of about six months.

  • Chip IDsECOS55-2606-Freighter-MPC01, ECOS55-2606-Cruise-MPC01
  • Actual TapeOut2026-05-08
  • Current WIPWafer Start in progress
  • Estimated Delivery2026-11-20
Design SubmittedActual date 2026-04-15
GDS ReadyActual date 2026-04-27
TapeOutActual date 2026-05-08
JDV CheckActual date 2026-05-18
Wafer StartActual date 2026-06-02
Mask INPlanned date 2026-06-15
Wafer FabricationPlanned date 2026-07-05
Customer ShippingPlanned date 2026-11-20

Historical Shuttle Gallery

Mock chips and user designs from previous voyages.

ECOS55-2512

uart-sensor-hub

Mira Patel, Freighter MPC, 0.06 mm², signoff passed, bare die delivered.

ECOS55-2603

rv32-lab-core

Northbridge Lab, Cruise MPC, 0.18 mm², packaged samples in board bring-up.

ECOS55-2603

tinypll-monitor

OpenClock Collective, Ark MPW, 1.6 mm², mixed-signal prototype delivered.

ECOS55-2510

qspi-accelerator

Wei Sun, Freighter MPC, 0.12 mm², devboard validation complete.

ECOS55-2510

osoc-ysyx-2214

OSOC cohort mock entry, OSOC MPC, signoff passed with coupon review.

ECOS55-2508

edge-ai-ctrl

HarborWorks, Ark MPW, 4.2 mm², customer shipping completed.

Next Shuttle

Book ECOS55-2610 before September 15, 2026.

Pick a template, submit a design, and bind it to a shuttle order when your files are ready.

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